KA

Features

  • Adjustment processes are decreased by function and ratio trimmings
  • High density mounting by bonding (COB)
  • Various types of package are available
  • High reliability achieved by KOAs original thick film technology
  • Thick film printed circuit substrate applies the non-noble metal paste (conductive paste and resistive paste) and receives the many total inquires including material selecting, pattern designing and mass production
 

Ordering Information

Ordering Information
 

Component - KA Series

Component - KA Series
Last Updated: 2/11/2019