WTP for Wire Bonding NEW

  • Electrode structure suitable for Al wire bonding of thick lines (Max. ø300µm)
  • Soldering and sintering can be mounted by metallization on the back side
  • AEC-Q200 qualified
  • Operating temperature range: -55°C~+200°C
  • Thermal time constant: 8.3 seconds

SDT73H, SDT73S General Purpose Chip Series Sensors

  • SMD platinum thin film thermal sensor
  • +3850ppm/°C is in accordance with JIS-DIN standards IEC
  • Operating temperature range: -55°C ~ +250°C
  • Thermal dissipation constant: 2.4mW/°C
  • Thermal time constant: 6.5 seconds

SDT73V Automotive Chip Series Sensors

  • AEC-Q200 Qualified
  • SMD platinum thin film thermal sensor
  • +3850ppm/°C is in accordance with JIS-DIN standards IEC
  • Operating temperature range: -55°C ~ +155°C
  • Thermal dissipation constant: 2.4mW/°C
  • Thermal time constant: 6.5 seconds