WTP for Wire Bonding NEW
Features
- Electrode structure suitable for AI wire bonding of thick lines (Max. ø300µm)
- Soldering and sintering can be mounted by metallization on the back side
- Products meet EU RoHS requirements
- AEC-Q200 Qualified
Ordering Information CHECK INVENTORY ORDER SAMPLES
Last Updated: 12/16/2025
Catalog Pages
Full Line Catalog
Selection Guide
