KA Hybrid IC

  • High density mounting by bonding (COB)
  • Adjusted processes are decreased by function and ratio trimmings
  • Substrate materials: AL2O3 alumina and glass epoxy
  • Printing: Conductor Resistance: Ag-Pd: 18mW/15μm, Heat Shock: -55°C ~ +125°C, 500 cycles, RuO2: 5W ~ 10MW, +100x10-6/K

KLCJ Custom Module

  • SMD (Hybrid IC)
  • Multiple semiconductors in one package offers downsized system with high performance and standardization
  • High precision modules by function trimming
  • Terminal pitch: 0.8mm ~
  • Mountable device: SMD, bare chip, printed resistor (trimmable)

MCM Multi-chip Module

  • SMD (Hybrid IC)
  • Multiple semiconductors in one package offers downsized system with high performance and standardization
  • High precision modules by function trimming
  • Terminal pitch: 0.8mm ~
  • Mountable device: SMD, bare chip, printed resistor (trimmable)