KLC

Features

  • KOAs substrates are suitable for bare chip mounting, as the thermal expansion cofficient is close to silicons one and outstanding dimensional accuracy and flatness.
  • Thanks to our low dielectric ceramics and low resistive conductors, the substrates excel in the high frequency characteristics
  • Minituarization and high integration are possible because of multilayer wiring, multi-cavity structure and the surface/buried printing resistors possibilities
  • Special shapes of substrate and cavity such as circle shape, polygonal shape and concave or convex shape are available
  • Thermal vias under bare chips can be implemented to improve the thermal conductivity of the substrate
  • The substrates are outstanding in heat resistance and humidity resistance. There will be no outgas occurrence from the ceramics.
  • Products meet EU RoHS requirements
 

Construction

Construction
 

Ordering Information

Ordering Information
 

What is LTCC?

What is LTCC?
 

Environmental Applications

Environmental Applications
Last Updated: 2/11/2019