MCM

Features

  • SMD (Hybrid IC)
  • Plural semiconductors in one package offers downsized system with high performance and standardization
  • Wiring space saving by multilayer fine patterns on build-up substrate. No signal delay by shortened wiring distance
  • High precision modules by function trimming
  • Less mounting problem because of the decreasing number of the terminals
 

Construction

Construction
Last Updated: 2/11/2019