TF Thin Film Chip Fuses
![TF10BN-007](./images/TF10BN-007.jpg)
Features
- Small, lightweight design
- Special manufacturing method stabilizing fusing characteristics and occupying less area
- Low power consumption and less voltage drop due to low internal resistance
- Suitable for overcurrent protection of circuit block in electronic devices
- Suitable for flow and reflow soldering
- Products meet EU RoHS requirements
![Dimensions and Construction](./images/charts/TF_1.png)
Ordering Information CHECK INVENTORY ORDER SAMPLES
![Ordering Information](./images/charts/TF_2.png)
![Applications and Ratings](./images/charts/TF_3.png)
![Applications and Ratings](./images/charts/TF_4.png)
![Environmental Applications](./images/charts/TF_5.png)
Last Updated: 11/15/2023