TF Thin Film Chip Fuse

Features
- Small, lightweight design
- Special manufacturing method stabilizing fusing characteristics and occupying less area
- Low power consumption and less voltage drop due to low internal resistance
- Suitable for overcurrent protection of circuit block in electronic devices
- Suitable for flow and reflow soldering
- Products with lead-free terminations meet EU RoHS and China RoHS requirements





Last Updated: 2/11/2019