Hybrid IC LTCC Substrates & Others
KA Hybrid IC SUbstrates
- High density mounting by bonding (COB)
- Adjusted processes are decreased by function and ratio trimmings
- Substrate materials: AL2O3 alumina and glass epoxy
- Printing: Conductor Resistance: Ag-Pd: 18mW/15μm, Heat Shock: -55°C ~ +125°C, 500 cycles, RuO2: 5W ~ 10MW, +100x10-6/K
KLCJ Custom Module Substrates
- SMD (Hybrid IC)
- Multiple semiconductors in one package offers downsized system with high performance and standardization
- High precision modules by function trimming
- Terminal pitch: 0.8mm ~
- Mountable device: SMD, bare chip, printed resistor (trimmable)
