KA Hybrid IC SUbstrates

  • Adjustment processes are decreased by function and ratio trimmings
  • Various types of package are available
  • High reliability achieved by KOAs original thick film technology

KLCJ Custom Module Substrates

  • SMD (Hybrid IC)
  • Multiple semiconductors in one package offers downsized system with high performance and standardization
  • High precision modules by function trimming
  • Terminal pitch: 0.8mm ~
  • Mountable device: SMD, bare chip, printed resistor (trimmable)