KLC LTCC Multilayer Substrates

  • Stack accuracy <20μm
  • Line width as low as 60μm
  • Special shapes of substrates and cavity (circle, polygonal, concave or convex shape available)
  • Line-to-line spacing as low as 60μm
  • Cavity flatness: <25μm
  • Cavity width: 600μm min.
  • Cavity depth: 100μm min.
  • Cavity wall thickness: 500μm min
  • Flexural/bonding strength: 250MPa (TCE): 5.5x10-6/K
  • Thermal conductivity: 3W/m-K
  • Min. insulation resistance: 1x1013W - cm
  • Denisty: 2.8g/cm3
  • Fired layer thickness: 80μm, 100μm, 125μm
  • Via diameter: 100μm, 150μm, 200μm