KLC LTCC Multilayer Substrates
![KLC](./images/KLC.jpg)
Features
- Suitable for bare chip mounting as it has thermal expansion coefficient close to that of silicon and excellent dimensional accuracy and flatness.
- Excellent high frequency characteristics are achieved by the low-loss dielectric ceramic and the low-loss conductor.
- Downsizing and high integration density can be achieved by the multilayer wiring, the multicavity structure and the surface/buried resistor printing.
- The substrate and the cavity can be formed in round, polygonal, concave or convex shape.
- Thermal vias can be placed in the bare chip mounting area to improve the thermal conductivity of the substrate.
- The use of ceramic material contribute to the excellent heat and humidity resistance and prevents outgas and dust generation.
- Products meet EU RoHS requirements
![Construction](./images/charts/KLC_1.png)
Ordering Information CHECK INVENTORY ORDER SAMPLES
![Ordering Information](./images/charts/KLC_2.png)
![What is LTCC?](./images/charts/KLC_3.png)
![High-Precision Specification](./images/charts/KLC_4.png)
![Environmental Applications](./images/charts/KLC_5.png)
Last Updated: 11/01/2023