KLC LTCC Multilayer Substrates

Features

• KOAs substrates are suitable for bare chip mounting, as the thermal expansion cofficient is close to silicons one and outstanding dimensional accuracy and flatness.
• Thanks to our low dielectric ceramics and low resistive conductors, the substrates excel in the high frequency characteristics
• Minituarization and high integration are possible because of multilayer wiring, multi-cavity structure and the surface/buried printing resistors possibilities
• Special shapes of substrate and cavity such as circle shape, polygonal shape and concave or convex shape are available
• Thermal vias under bare chips can be implemented to improve the thermal conductivity of the substrate
• The substrates are outstanding in heat resistance and humidity resistance. There will be no outgas occurrence from the ceramics.
• Products meet EU RoHS requirements