Modules

Features

• The high-density wiring by the fine line and pattern is available
• Miniaturization is possible by burying L, C and Strip-line
• By the uses of low dielectric-loss ceramics and low loss conductors, the substrates excel in the high frequency characteristic
• As the thermal expansion coefficient is close to silicon’s, the substrates are suitable for the bare chip mounting
• By preparing the thermal vias under bare chips, the substrates are excellent in the heat dissipation
• The substrates are outstanding in heat resistance and humidity resistance due to the ceramics used